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Shenzhen Yufuxin Technology Co., Ltd.
Panasonic N610154874AA SMT High Speed Chip Mounter Npm-W2 Placement Machine
| Model ID | NPM-W2 | |||||
|
Rear head Front head |
Lightweight 16-nozzle head |
12-nozzle head |
Lightweight 8-nozzle head |
3-nozzle head V2 | Dispensing head | No head |
| Lightweight 16-nozzle head | NM-EJM7D | NM-EJM7D-MD | NM-EJM7D | |||
| NM-EJM7D-MD | ||||||
| Dispensing head | NM-EJM7D-MD | NM-EJM7D-D | ||||
| Inspection head | NM-EJM7D-MA | NM-EJM7D-A | ||||
| No head | NM-EJM7D | NM-EJM7D-D | ||||
|
PCB dimensions (mm) |
Single-lane*1 | Batch mounting | L 50 x W 50 ~ L 750 x W 550 |
| 2-positin mounting | L 50 x W 50 ~ L 350 x W 550 | ||
| Dual-lane*1 | Dual transfer (Batch) | L 50 × W 50 ~ L 750 × W 260 | |
| Dual transfer (2-positin) | L 50 × W 50 ~ L 350 × W 260 | ||
| Single transfer (Batch) | L 50 × W 50 ~ L 750 × W 510 | ||
| Single transfer (2-positin) | L 50 × W 50 ~ L 350 × W 510 | ||
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA | ||
| Pneumatic source *2 | 0.5 MPa, 200 L /min (A.N.R.) | ||
| Dimensions *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | ||
| Mass | 2 470 kg (Only for main body : This differs depending on the option configuration.) | ||
| Placement head |
Lightweight 16-nozzle head (Per head) |
12-nozzle head (Per head) |
Lightweight 8-nozzle head (Per head) |
3-nozzle head V2 (Per head) |
|||
| High production mode [ON] | High roduction mode [OFF] | High production mode [ON] | High production mode [OFF] | ||||
| Max. speed |
38 500cph (0.094 s/ chip) |
35 000cph (0.103 s/ chip) |
32 250cph (0.112 s/ chip) |
31 250cph (0.115 s/ chip) |
20 800cph (0.173 s/ chip) |
8 320cph (0.433 s/ chip) 6 500cph (0.554 s/ QFP) |
|
|
Placement accuracy (Cpk1) |
±40 μm / chip |
±30 μm / chip (±25μm / chip)*6 |
±40 μm / chip | ±30 μm / chip |
± 30 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP 12mm Under |
± 30 µm/QFP | |
|
Component dimensions (mm) |
0402*7 chip ~ L 6 x W 6 x T 3 | 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 | 0402*7 chip ~ L 12 x W 12 x T 6.5 | 0402*7 chip ~ L 32 x W 32 x T 12 | 0603 chip to L 150 x W 25 (diagonal152) x T 30 | ||
|
Component supply |
Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm | |||
| Max.120 (Tape: 4, 8 mm) |
Front/rear feeder cart specifications : Max.120 ( Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 ( Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 ( Tape width and feeder are subject to the conditions on the left) |
||||||
| Stick |
Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder) |
||||||
| Tray |
Single tray specifications : Max.20 Twin tray specifications : Max.40 |
||||||
| Dispensing head | Dot dispensing | Draw dispensing |
| Dispensing speed | 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) | 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 |
| Adhesive position accuracy (Cpk1) | ± 75 μ m /dot | ± 100 μ m /component |
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | BGA, CSP |
| Inspection head | 2D inspection head (A) | 2D inspection head (B) | |
| Resolution | 18 µm | 9 µm | |
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | |
|
Inspection processing time |
Solder Inspection *10 |
0.35s/ View size | |
|
Component Inspection *10 |
0.5s/ View size | ||
| Inspection object |
Solder Inspection *10 |
Chip component : 100 μm × 150 μm or more (0603 or more) Package component : φ150 μm or more |
Chip component : 80 μm × 120 μm or more (0402 or more) Package component : φ120 μm or more |
|
Component Inspection *10 |
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 | Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 | |
| Inspection items |
Solder Inspection *10 |
Oozing, blur, misalignment, abnormal shape, bridging | |
|
Component Inspection *10 |
Missing, shift, flipping, polarity, foreign object inspection *12 | ||
| Inspection position accuracy *13 ( Cpk1) | ± 20 μm | ± 10 μm | |
| No. of inspection | Solder Inspection *10 | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | |
| Component Inspection *10 | Max. 10 000 pcs./machine | ||
| *1 | : | Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM. |
| *2 | : | Only for main body |
| *3 | : | 1 880 mm in width if extension conveyors (300 mm) are placed on both sides. |
| *4 | : |
Dimension D including tray feeder : 2 570 mm Dimension D including feeder cart : 2 465 mm |
| *5 | : | Excluding the monitor, signal tower and ceiling fan cover. |
| *6 | : | ±25 μm placement support option.(Under conditions specified by PSFS) |
| *7 | : | The 03015/0402 chip requires a specific nozzle/feeder. |
| *8 | : | Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip) |
| *9 | : | A PCB height measurement time of 0.5s is included. |
| *10 | : | One head cannot handle solder inspection and component inspection at the same time. |
| *11 | : | Please refer to the specification booklet for details. |
| *12 | : | Foreign object is available to chip components.(Excluding 03015 mm chip) |
| *13 | : | This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature. |